Ufs - Bga 254 Datasheet

AI-driven edge computing, 5G high-throughput gateways. 6. PCB Design and Hardware Layout Guidelines

Unlike older eMMC architectures that rely on a parallel bus interface, UFS utilizes a high-speed, serial, bi-directional differential signaling interface based on the MIPI M-PHY physical layer and UniPro link layer protocols. The BGA 254 package commonly supports UFS 2.1, UFS 3.0, UFS 3.1, and UFS 4.0 standards, varying by manufacturer and generation. Key Technological Advantages Ufs Bga 254 Datasheet

BGA 254 is a type of packaging used for UFS devices. BGA stands for Ball Grid Array, which refers to the arrangement of solder balls on the package. The "254" in BGA 254 represents the number of solder balls on the package, which is 254 in this case. The BGA 254 package is a compact and reliable packaging solution that provides a high degree of connectivity and durability. AI-driven edge computing, 5G high-throughput gateways

Fully compliant with JEDEC UFS 2.1, UFS 3.1, or UFS 4.0 specifications. The BGA 254 package commonly supports UFS 2

The 254-ball layout is divided between the UFS controller interface, the NAND flash power domains, and optional LPDDR memory lines (if utilizing a uMCP package). Primary UFS Interface Signals Signal Name Description Differential Receive Data Lane 0 (True / Complement) DIN1_t / DIN1_c Differential Receive Data Lane 1 (True / Complement) DOUT_t / DOUT_c Differential Transmit Data Lane 0 (True / Complement) DOUT1_t / DOUT1_c Differential Transmit Data Lane 1 (True / Complement) REF_CLK